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Solder & Fluxes (Lead Free)

Sn63Pb37 Solder Wire (No Clean & Rosin Cored)



This application is suitable for hand Soldering Process in Electronic & Electrical Assemblies. Soldering Iron Set Temperatures ranging from 350°C to 400°C are recommended to get desired Solder Joints. Application has designed with No-Clean Flux Cored in Solder & Residues may form on Joints which may contribute no impact to Circuit Assemblies. Cleaning should be done when Rosin Cored Solder Wire used.

Storage & Handling

Product Specifictions

Sl No Item Specification Standard
1 Appearance Bright and shiny finishes NA
2 Alloy Sn/Pb37 JIS-Z-3282 A CLASS
3 Melting Point 1830C (NA for Rosin Cored Wires) DSC
4 Flux Content 1.3%, 1.8%,2%& 2.2% ±0.1 % JIS-Z-3283
5 Packaging 500gm,  
6 Diameter/Tolerance 16SWG,18SWG,20SWG,22SWG,24 SWG & 26 SWG JIS-Z-3283
7 Features Excellent solder joint reliability.
Superior joint strength.
Excellent thermal & Mechanical fatigue resistance.
Low cleaning required after solder jointJIS-Z-3197
8 Purpose For use in applications requiring good activation.

Physical Properties

Sl No Test Item Test Result Test Method
1 Silver Chromate Test PASS IPC-TM-650, 2.6.33
2 Copper Mirror Test PASS IPC-TM-650, 2.6.32
3 Copper plate Corrosion PASS JIS-Z-3197, 6.6.1
4 S.I.R Test 1×109 up IPC-TM-650,
5 Electro migration Test 1×10912up IPC-TM-650,
8 Purpose For use in applications requiring good activation.

Alloy Composition

(Sn) (Pb) (Sb) (Cu) (Bi) (Zn) (Fe) (Al) (As) (Cd)
REM 36.5~37.5 0.12 Max 0.05 Max 0.10 Max 0.002 Max 0.02 Max 0.002 Max 0.03 Max 0.002 Max