PAI Solvent / Thinner
PAI Solvent / Thinner is exclusively designed for retaining Flux Solid concentration in Wave Soldering Liquid Fluxes to get maximum Performance and defect free Soldering.
Application
During Processing the Liquid Fluxes, it is tend to evaporate when oxygen interfaces at Fluxing Process and loses its required Specific Gravity. To retain Factory established formulation & characteristics of Liquid Fluxes, PAI Solvent/Thinner is to be added with respect to maintain required Specific Gravity of respective Fluxes. Especially applicable at Foam or Wave Type Fluxing Processes in Wave Soldering Systems.
It is used widely as a solvent and as a cleaning fluid, especially for dissolving oils
Feature & Benefits
- Non-toxic compared to alternative solvents
- Fast Drying.
- Dries to zero residue
- Post soldering flux residues generally are removed
Storage Life & Indication
- Store in cool place and tighten the cap. Do not expose to sunlight or heat source.
Safety Indication
- PAI Thinner must not be used near open flames or near non-flameproof electrical equipment. Please refer to the Material Safety Data Sheet as the primary source of health and safety information.
Technical Specifications
Property |
Test Method |
Unit |
Spec |
Result |
Purity |
GAS CHRO |
Wt % |
> 99.8 |
99.98 |
Color |
ASTM D 1209 |
APHA |
< 5 |
2 |
Water |
ASTM D 1364 |
Wt % |
< 0.05 |
0.0060 |
SP.GR (20/4 C) |
ASTM D 1298 |
- |
0.785~ 0.787 |
0.786 |
Acidity |
ASTM D 1613 |
Wt ppm |
<10 |
2 |
KMNO4_Test |
ASTM D 1363 |
Min |
> 30 |
40 |
R.E(Residue after Evaporation) |
ASTM D 1353 |
Wt ppm |
<15 |
4 |