Our Locations

Mumbai - Pune Highway,
Dapodi, Pune

Telephone Number

+91 9607877448 / 49

Email Address


Solder & Fluxes (Lead Free)

PAI SP610 ( SAC305 ) Pb Free SOLDER WIRE

PAI SAC305 RoHS Compliance Solder Wires are being formulated with High Virgin Raw Metals Processed in state-of-the-art Vaccualloy Technology that brings world class Quality along. Here, Oxygen interaction with Alloy is Nil and thus, Dross formulation is reduced at PCB Assembly Process. Also an increase flow rate & reduced impurities found. PAI SAC305 Alloy is compatible for a typical range of Flux Application Formulas used in Electronics Industry Today.

Storage & Handling

Product Specifictions

Sl No Item Specification Standard
1 Appearance Bright and shiny surface finishes  
2 Alloy Sn/Ag3.0/Cu0.5/Ni0.06/Ge0.01 JIS-Z-3282 A CLASS
3 Melting Point 217~2190C DSC
4 Flux Content 2% & 2.2% ±0.2 % JIS-Z-3283
5 Halide Content Under 0.1% JIS-Z-3283
6 Gravity 7.4  
7 Spread ability > 80% JIS-Z-3197
8 Packaging 500g,  
9 Diameters Tolerances 1.6mm,1mm,0.8mm,0.7mm  &0.6mm JIS-Z-3283
10 Flux Type ROL1 J-STD-004
11 RoHS Complaint Yes International Standards
12 Features Excellent solder joint reliability. Superior joint strength.
    Excellent thermal & Mechanical fatigue resistance. Low cleanin
    required after solder joint  
13 Purpose For use in applications requiring good activation.

Physical Characteristics of Application

Sl No Test Item Test Result Test Method
1 Silver Chromate Test PASS IPC-TM-650, 2.6.33
2 Copper Mirror Test PASS IPC-TM-650, 2.6.32
3 Copper plate Corrosion PASS JIS-Z-3197, 6.6.1
4 S.I.R Test 1×109 up IPC-TM-650,
5 Electro migration Test 1×10912up IPC-TM-650,

Alloy Composition

(Sn) (Ag) (Cu) (Ni) (Ge) (Zn) (Al) (Sb) (Fe) (As) (Bi) (Cd) (Pb)
REM. 2.9~3.1 0.4~0.6 0.04~0.08 0.005~0.02 0.002 Max 0.002 Max 0.12 Max 0.02 Max 0.03 Max 0.10 Max 1 RPM 100 RPM