PAI 8239 No Clean Liquid Flux
PAI 8239 No-clean Liquid Flux is designed for both tin-lead & lead-free wave soldering. It contains low solid contents including modified resin and organic activator to improve solder-ability and reduce flux residue. The surface insulation resistance (SIR) of PAI 8239 is very high under unclean condition and follows the spec of IPC-TM-650 2.6.3.3.
Thinner : Used for adjusting flux concentration.
Applying Method : Foam, Spray and Wave methods.
Application Indications
- When using the foam or wave method of application, an air knife is recommended after the flux operation to ensure the flux is uniformly distributed across the board.
- The flux should be supplied with compressed air which is free of oil and water when using foam method. The flux level should be maintained 2.5 cm to 4 cm above the top of the stone. Adjust the air pressure to produce the optimum foam height with a fine, uniform foam head.
- Thinner to maintain the activity if the solvent evaporated from flux. Using specific gravity method to control the concentration is not recommended because PAI 8239 has low solid content.
- It is recommended to replace the flux in tank after 40 hours operation because debris and contaminants will accumulate in the applicators. After emptying the flux, the reservoir and foam stone should be thoroughly cleaned with Thinner.
Operating Parameter
| Item |
Typical Level |
| Amount of Flux Applied |
Foam: 500~1200 µg/in² of solids/in² |
| |
Spray: 350~830 µg/in² Solids |
| Topside Preheat Temperature |
85℃~130℃ (Best: 100℃~125℃) |
| Bottom side Preheat Temperature |
100℃~145℃(Best: 110℃~130℃) |
| Maximum Ramp Rate of Topside Temp. |
2℃/second maximum |
| Conveyor Speed |
0.7~1.5m/min. Best (0.7~1.1m/min) |
| Conveyor Angle |
4°Δ ~8°Δ (6°Δ most common) |
| Dwell Time |
2~6sec |
| Solder Pot Temp. |
255℃~265℃(Sn/Ag3.0~4.0/Cu 0.5~0.9 Solder Bar) |
| |
265℃~280℃(Sn/Cu 0.7 Solder Bar) |
| |
250℃~260℃ (Sn/Pb37 Solder Bar) |
Technical Specification
| Item |
Result |
| Appearance |
Transparent to Light Yellow Liquid |
| Applications |
Foaming, Spraying & Wave |
| Specific Gravity ， 20℃ |
0.795 ± 0.010 |
| Acid Number, mg KOH/g |
19.0 ± 4.5 |
| Solids Content，％ |
2.6 ± 0.3 |
Physical Properties & Reliability Data
Storage, Shelf Life Indication
Store in cool place and tighten the cap. Do not expose to sunlight or heat source. 12 Months from the Date of manufacturing.
Safety Indication
The flux must not be used near open flames or near non-flameproof electrical equipment. Please refer to the Material Safety Data Sheet as the primary source of health and safety information.
