Sn63Pb37 Solder Wire (No Clean & Rosin Cored)
Description
- High purity Alloy that is composed of 63% Tin and 37% Lead from Virgin Metals.
- Applies at Hand or Feed Soldering Process in Electronic & Electrical Assemblies.
- Non-Corrosive and No Impact of Residues form at Post Soldering which means of passes in Pin Probe & Flying Probe Tests for No Clean Wires.
- If requires, Residues shall clean with appropriate Liquid Application.
- Précised amount of Flux cored from state-of the-art-Technology Process.
Application
This application is suitable for hand Soldering Process in Electronic & Electrical Assemblies. Soldering Iron Set Temperatures ranging from 350°C to 400°C are recommended to get desired Solder Joints. Application has designed with No-Clean Flux Cored in Solder & Residues may form on Joints which may contribute no impact to Circuit Assemblies. Cleaning should be done when Rosin Cored Solder Wire used.
Storage & Handling
- Do not use Fire near storage area.
- Store in Dry, Cool and Non-Corrosive environment.
- Wear Personal Protective Equipments while Handling. Wear Personal Protective Equipments while Processing.
Product Specifictions
Sl No |
Item |
Specification |
Standard |
1 |
Appearance |
Bright and shiny finishes |
NA |
2 |
Alloy |
Sn/Pb37 |
JIS-Z-3282 A CLASS |
3 |
Melting Point |
1830C (NA for Rosin Cored Wires) |
DSC |
4 |
Flux Content |
1.3%, 1.8%,2%& 2.2% ±0.1 % |
JIS-Z-3283 |
5 |
Packaging |
500gm, |
|
6 |
Diameter/Tolerance |
16SWG,18SWG,20SWG,22SWG,24 SWG & 26 SWG |
JIS-Z-3283 |
7 |
Features |
Excellent solder joint reliability. Superior joint strength.
Excellent thermal & Mechanical fatigue resistance.
Low cleaning required after solder jointJIS-Z-3197 |
8 |
Purpose |
For use in applications requiring good activation. |
Physical Properties
Sl No |
Test Item |
Test Result |
Test Method |
1 |
Silver Chromate Test |
PASS |
IPC-TM-650, 2.6.33 |
2 |
Copper Mirror Test |
PASS |
IPC-TM-650, 2.6.32 |
3 |
Copper plate Corrosion |
PASS |
JIS-Z-3197, 6.6.1 |
4 |
S.I.R Test |
1×109 up |
IPC-TM-650, 2.6.3.3 |
5 |
Electro migration Test |
1×10912up |
IPC-TM-650, 2.6.14.1 |
8 |
Purpose |
For use in applications requiring good activation. |
Alloy Composition
(Sn) |
(Pb) |
(Sb) |
(Cu) |
(Bi) |
(Zn) |
(Fe) |
(Al) |
(As) |
(Cd) |
REM |
36.5~37.5 |
0.12 Max |
0.05 Max |
0.10 Max |
0.002 Max |
0.02 Max |
0.002 Max |
0.03 Max |
0.002 Max |