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Mumbai - Pune Highway,
Dapodi, Pune

Telephone Number

+91 9021117448/49/50

Email Address

bakare@sharang.co.in

Solder & Fluxes (Lead Free)

Sn63Pb37 Solder Sticks

PAI Sn63Pb37 solder sticks are being formulated with virgin raw metals processed in state-of-the-art Vaccualloy Technology that brings world class quality along. Here, oxygen interaction with alloy is nil and thus, dross formation is reduced at PCB assembly or PCB manufacturing processes. Also an increased flow rate & reduced impurities found. PAI Sn63Pb37 is compatible with typical range of flux application formulas used in Electronics Industry today.

Storage & Handling

Alloy Composition

Sl. No Metal PAI Sn63Pb37 Solder Sticks ISO9453 Specification J-STD-006 Specification
1 Sn 63% min 62.5%~63.50% 62.5%~63.50%
2 Pb Rem Rem Rem
3 Sb 0.05% max 0.05% max 0.5% max
4 Cu 0.05% max 0.05% max 0.08% max
5 Au 0.05% max 0.05% max NA
6 Ag 0.10% max NA 0.10% max
7 Al 0.001% max 0.001% max 0.005% max
8 As 0.03% max 0.03% max 0.03% max
9 Bi 0.05% max 0.05% max 0.25% max
10 Cd 0.002% max 0.002% max 0.001% max
11 In 0.003% max NA NA
12 Fe 0.02% max 0.02% max 0.02% max
13 Ni 0.01% max NA 0.01% max
14 Zn 0.001% max 0.001% max 0.003% max
15 S 0.0004% max NA NA

Physical Characteristics of Application

Alloy Sn63Pb37
Shape Rectangular
Density 8.4gm/cm³ at 200C
Melting Point 1830C
Standard Package Quantity 25Kgs
Application Wave Soldering / HASL Process
Standards Considered JIS-Z-3282
Shelf Life 10 Years

Technical Specifications

Technical Factors Recommended Specifications
Solder Pot Temperature 250°C to 260°C
Dwell Time 2 Sec to 4 Sec
Immersion 0.5% to 0.70% of PWBs thickness that being processed
Dross Recovery Once in every 8 hours
Impurities Level Check In-house specifications
Other Factors Refer liquid flux manufacturer specifications for desired yields