SH-6209 RMA No Clean Solder Paste
PAI SnPb40 Sticks are being formulated with High Virgin Raw Metals Processed in state-of-the-art Vaccualloy Technology that brings world class Quality along. Here, Oxygen interaction with Alloy is Nil and thus, Dross formulation is reduced at PCB Assembly Process. Also an increase flow rate & reduced impurities found. PAI SnPb40 Alloy is compatible for a typical range of Flux Application Formulas used in Electronics Industry Today.
Storage & Handling
- Do not use Fire near storage area.
- Store in Dry, Cool and Non-Corrosive environment.
- Wear Personal Protective Equipments while Handling. Wear Personal Protective Equipments while Processing.
Specifications
| No |
Item |
Specification |
Standard |
| 1 |
Appearance |
Gray paste, No foreign, No Stiff |
|
| 2 |
Alloy |
Sn62 / Ag2 / Pb36 |
JIS-Z-3282 |
| 3 |
Melting Point |
179~189°C |
DSC |
| 4 |
Particle Size |
(Type 3) +45µm 1% less, -20µm 10% less |
IPC-TM-650, 2.2.14 |
| |
|
(Type 4) +38µm 1% less, -20µm 10% less |
|
| 5 |
Powder Shape |
Sphere |
|
| 6 |
Flux Content |
10.0 ± 1.0 wt% |
JIS-Z-3197, 6.1 |
| 7 |
Halide Content |
<0.1 wt% (in flux) |
J-STD-004 |
| 8 |
Viscosity |
200 ± 30 Pa.S (25±1°C, 10rpm, Malcom ) |
JIS-Z-3284, Annex 6 |
| 9 |
Flux Type |
ROL0 |
J-STD-004 |
Physical Properties & Reliability Data
| No |
Test Item |
Test Result |
Test Method |
| 1 |
Copper Plate Corrosion Test |
PASS |
JIS-Z-3197, 6.6.1 |
| 2 |
Spread Test |
90% |
JIS-Z-3197, 6.10 |
| 3 |
Silver Chromate Test |
PASS |
IPC-TM-650, 2.3.33 |
| 4 |
Copper Mirror Test |
PASS |
IPC-TM-650, 2.3.32 |
| 5 |
Fluorides By Spot Test |
PASS |
IPC-TM-650, 2.3.35.1 |
| 6 |
S.I.R Test ▲ |
1×109 up |
IPC-TM-650, 2.6.3.3 |
| 7 |
Electro Migration Test ◆ |
1×1012 up Pass |
IPC-TM-650, 2.6.14.1 |
| 8 |
Viscosity Test (25°C,10rmp) |
200 ± 30 Pa.s |
JIS-Z-3284. Annex 6 |
| 9 |
Tack Test (gf) |
ROL0 |
J-STD-004 |
| 10 |
Slump Test |
Less than 0.3 mm |
JIS-Z-3284. Annex 8 |
| 11 |
Solder Ball Test |
PASS |
JIS-Z-3284. Annex 11 |
▲Test Conditions ： 85°C， 85% RH ◆Test Conditions： 65°C, 85% RH
Alloy Composition
| (Sn) |
(Ag) |
(Pb) |
(Cu) |
(Zn) |
(Al) |
(Sb) |
(Fe) |
(As) |
(Bi) |
(Cd) |
| 62.0 ±1.0 |
2.0 ±0.3 |
REM. |
0.05 Max |
0.002 Max |
0.002 Max |
0.12 Max |
0.02 Max |
0.03 Max |
0.1 Max |
0.002 Max |
