Our Locations

Mumbai - Pune Highway,
Dapodi, Pune

Telephone Number

+91 9021117448/49/50

Email Address

bakare@sharang.co.in

Solder & Fluxes (Lead Free)

SH-6209 RMA No Clean Solder Paste

PAI SnPb40 Sticks are being formulated with High Virgin Raw Metals Processed in state-of-the-art Vaccualloy Technology that brings world class Quality along. Here, Oxygen interaction with Alloy is Nil and thus, Dross formulation is reduced at PCB Assembly Process. Also an increase flow rate & reduced impurities found. PAI SnPb40 Alloy is compatible for a typical range of Flux Application Formulas used in Electronics Industry Today.

Storage & Handling

Specifications

No Item Specification Standard
1 Appearance Gray paste, No foreign, No Stiff  
2 Alloy Sn62 / Ag2 / Pb36 JIS-Z-3282
3 Melting Point 179~189°C DSC
4 Particle Size (Type 3)  +45µm 1% less, -20µm 10% less IPC-TM-650, 2.2.14
    (Type 4) +38µm 1% less, -20µm 10% less  
5 Powder Shape Sphere  
6 Flux Content 10.0 ± 1.0 wt% JIS-Z-3197, 6.1
7 Halide Content <0.1 wt% (in flux) J-STD-004
8 Viscosity 200 ± 30 Pa.S (25±1°C, 10rpm, Malcom ) JIS-Z-3284, Annex 6
9 Flux Type ROL0 J-STD-004

Physical Properties & Reliability Data

No Test Item Test Result Test Method
1 Copper Plate Corrosion Test PASS JIS-Z-3197, 6.6.1
2 Spread Test 90% JIS-Z-3197, 6.10
3 Silver Chromate Test PASS IPC-TM-650, 2.3.33
4 Copper Mirror Test PASS IPC-TM-650, 2.3.32
5 Fluorides By Spot Test PASS IPC-TM-650, 2.3.35.1
6 S.I.R Test ▲ 1×109 up IPC-TM-650, 2.6.3.3
7 Electro Migration Test  ◆ 1×1012 up Pass IPC-TM-650, 2.6.14.1
8 Viscosity Test (25°C,10rmp) 200 ± 30 Pa.s JIS-Z-3284. Annex 6
9 Tack Test (gf) ROL0 J-STD-004
10 Slump Test Less than 0.3 mm JIS-Z-3284. Annex 8
11 Solder Ball Test PASS JIS-Z-3284. Annex 11

▲Test Conditions : 85°C, 85% RH ◆Test Conditions: 65°C, 85% RH


Alloy Composition

(Sn) (Ag) (Pb) (Cu) (Zn) (Al) (Sb) (Fe) (As) (Bi) (Cd)
62.0 ±1.0 2.0 ±0.3 REM. 0.05 Max 0.002 Max 0.002 Max 0.12 Max 0.02 Max 0.03 Max 0.1 Max 0.002 Max