PF609-P No Clean Solder Paste
Specification
No |
Item |
Specification |
Standard |
1 |
Appearance |
Gray Paste, No Foreign, No Stiff |
|
2 |
Alloy |
Sn/Ag0.3/Cu0.7 |
JIS-Z-3282 |
3 |
Melting Point |
217°C~226°C |
DSC |
4 |
Particle Size |
(Type 3) +45µm 1% less, ─20µm 10% less |
IPC-TM-650, 2.2.14 |
|
|
(Type 4) +38µm 1% less, ─20µm 10% less |
|
5 |
Powder Shape |
Sphere |
|
6 |
Flux Content |
11 ± 1.0 wt% |
JIS-Z-3197, 6.1 |
7 |
Halide Content |
<0.1 wt% (in flux) |
J-STD-004 |
8 |
Viscosity |
200 ± 30 PA.s (25±1°C, 10rpm, Malcom ) |
JIS-Z-3284, Annex 6 |
9 |
Flux Type |
ROL0 |
J-STD-004 |
10 |
RoHS Compliant |
Yes |
International Standards |
Physical Properties & Reliability Data
No |
Test Item |
Test Result |
Test Method |
1 |
Copper Plate Corrosion Test |
PASS |
JIS-Z-3197, 6.6.1 |
2 |
Spread Test |
70% up |
JIS-Z-3197, 6.10 |
3 |
Silver Chromate Test |
PASS |
IPC-TM-650, 2.3.33 |
4 |
Copper Mirror Test |
PASS |
IPC-TM-650, 2.3.32 |
5 |
Fluorides By Spot Test |
PASS |
IPC-TM-650, 2.3.35.1 |
6 |
S.I.R Test ▲ |
1×109 up |
IPC-TM-650, 2.6.3.3 |
7 |
Electro Migration Test ◆ |
1×1012 up Pass |
IPC-TM-650, 2.6.14.1 |
8 |
Viscosity Test (25°C,10rmp) |
200 ± 30 Pa.s |
JIS-Z-3284. Annex 6 |
9 |
Tack Test (gf) |
140 up (8hr) |
JIS-Z-3284. Annex 9 |
10 |
Slump Test |
Less than 0.3 mm |
JIS-Z-3284. Annex 8 |
11 |
Solder Ball Test |
PASS |
JIS-Z-3284. Annex 11 |
▲Test Conditions : 85°C, 85% RH ◆Test Conditions: 65°C, 85% RH
ALLOY COMPOSITION in %
(Sn) |
(Ag) |
(Cu) |
(Ni) |
(Ge) |
(Zn) |
(Al) |
(Sb) |
(Fe) |
(As) |
(Bi) |
(Cd) |
(Pb) |
REM. |
0.2~0.4 |
0.5~0.9 |
0.0~0.01 |
0.0~0.01 |
0.001 Max |
0.001 Max |
0.05 Max |
0.02 Max |
0.03 Max |
0.06 Max |
0.002 Max |
0.05 Max |