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Solder & Fluxes (Lead Free)

PAI 8239 No Clean Liquid Flux

PAI 8239 No-clean Liquid Flux is designed for both tin-lead & lead-free wave soldering. It contains low solid contents including modified resin and organic activator to improve solder-ability and reduce flux residue. The surface insulation resistance (SIR) of PAI 8239 is very high under unclean condition and follows the spec of IPC-TM-650 2.6.3.3.

Thinner : Used for adjusting flux concentration.

Applying Method : Foam, Spray and Wave methods.

Application Indications

Operating Parameter

Item Typical Level
Amount of Flux Applied Foam: 500~1200 µg/in² of solids/in²
  Spray: 350~830 µg/in² Solids
Topside Preheat Temperature 85℃~130℃ (Best: 100℃~125℃)
Bottom side Preheat Temperature 100℃~145℃(Best: 110℃~130℃)
Maximum Ramp Rate of Topside Temp. 2℃/second maximum
Conveyor Speed 0.7~1.5m/min. Best (0.7~1.1m/min)
Conveyor Angle 4°Δ ~8°Δ (6°Δ most common)
Dwell Time 2~6sec
Solder Pot Temp. 255℃~265℃(Sn/Ag3.0~4.0/Cu 0.5~0.9 Solder Bar)
  265℃~280℃(Sn/Cu 0.7 Solder Bar)
  250℃~260℃ (Sn/Pb37 Solder Bar)

Technical Specification

Item Result
Appearance Transparent to Light Yellow Liquid
Applications Foaming, Spraying & Wave
Specific Gravity , 20℃ 0.795 ± 0.010
Acid Number, mg KOH/g 19.0 ± 4.5
Solids Content,% 2.6 ± 0.3


Physical Properties & Reliability Data

Storage, Shelf Life Indication

Store in cool place and tighten the cap. Do not expose to sunlight or heat source. 12 Months from the Date of manufacturing.

Safety Indication

The flux must not be used near open flames or near non-flameproof electrical equipment. Please refer to the Material Safety Data Sheet as the primary source of health and safety information.